In this paper we present a complete modular PCB manufacturing process on fablab scale that is compliant with current PCB manufacturing standards. This includes, but is not limited to, a minimum track width of 8 mil, a minimum clearance of 6 mil, plated and non plated holes, a solder resist, surface finish and component overlay. We modularize industrial manufacturing processes and discuss advantages and disadvantages of production techniques for every phase. We then proceed to discuss the relevance and added value of every phase in the manufacturing process and their usefulness in a fablab context. Production techniques are evaluated regarding complexity, overhead, safety, required time, and environmental concerns. To ensure practical feasibility of the presented techniques, the manufacturing process is benchmarked in FablabXL and aims to be a practical reference for implementing or extending PCB manufacturing activities in fablabs.

Full text: IJEIR-454 Final N.pdf